| 摘要 |
<p>An apparatus for thermal treatment of a wafer comprising a vacuum chamber (10) with a heater block (20) positioned in the vacuum chamber (10) and a clamp means (31) which presses against the wafer positioned on the heater block (20) with the weight of the clamp (31). A vacuum means (60) forms a vacuum in the chamber (10) and a gas supply means (100) supplies gas into the chamber (10) to provide a uniform temperature. A wafer supply means (50) supplies the wafer to the clamp means (31) for heat treatment.</p> |
