发明名称 |
FLEXIBILE PCB |
摘要 |
The printed circuit board(PCB) includes a bonding layer between an insulating film and thin metal layer. The bonding layer is manufactured by coating the insulating film with a mixture consisting of (in wt.%) 10-60% epoxy resin, 20-45% polyamide resin, 10-50% phenol resin and 0.1-3% aromatic amine, and drying the coating. The PCB has excellent interlayer bonding strength, heat resistance and chemical resistance.
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申请公布号 |
KR950012751(B1) |
申请公布日期 |
1995.10.20 |
申请号 |
KR19890008236 |
申请日期 |
1989.06.15 |
申请人 |
DONG YANG NYLON CO., LTD. |
发明人 |
JONG, JONG - KU;SO, SUNG - WON;JONG, YON - SOK |
分类号 |
H05K3/30;(IPC1-7):H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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