发明名称 FLEXIBILE PCB
摘要 The printed circuit board(PCB) includes a bonding layer between an insulating film and thin metal layer. The bonding layer is manufactured by coating the insulating film with a mixture consisting of (in wt.%) 10-60% epoxy resin, 20-45% polyamide resin, 10-50% phenol resin and 0.1-3% aromatic amine, and drying the coating. The PCB has excellent interlayer bonding strength, heat resistance and chemical resistance.
申请公布号 KR950012751(B1) 申请公布日期 1995.10.20
申请号 KR19890008236 申请日期 1989.06.15
申请人 DONG YANG NYLON CO., LTD. 发明人 JONG, JONG - KU;SO, SUNG - WON;JONG, YON - SOK
分类号 H05K3/30;(IPC1-7):H05K3/30 主分类号 H05K3/30
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