| 摘要 |
PURPOSE:To provide a laser beam machine capable of correctly measuring the position of the point to be machined without being affected by the condition of the surface of the semi-conductor wafer, and capable of performing excellent laser beam machining. CONSTITUTION:In a laser beam machine where a plurality of measuring points 17 are set on the surface of the semi-conductor wafer 11, the respective measuring points 17 are irradiated with the laser beam 14 from the laser beam source 9 for focusing, the reflected beam is received by a focus sensor 10 to measure the position of the respective measuring point 17 (the position in the direction of the optical axis of the laser beam L1), and the position of a fuse 18 which is the point to be machined is obtained from the mean value of the position at the respective measuring points 17, a plurality of the measuring points 17 are set on the surface of the semi-conductor wafer 11 which is also the part where a protective film 19 is not covered. This constitution prevents the reflection of the laser beam L4 on the surface of the protective film 19 when the position of the measuring points is measured, and allows the correct measurement of the position (the position in the direction of the optical axis of the laser beam L1) of the point to be machined (the fuse 18). |
