SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE

摘要

A semiconductor package suitable for an increase in the degree of integration is provided. The package comprises a base including conductors made of nickel-coated electrolytic copper foil; and an LSI chip mounted on the copper foil, connected to the conductors at its terminal and sealed with epoxy resin. In the process of producing the package base, the copper foil alone is removed with an alkali etchant, and the exposed nickel layer is removed with a liquid that can hardly dissolve copper whereby interconnections are exposed. A pattern is formed so as to expose connecting terminals by applying a solder resist, and solder balls placed on the exposed terminals are fused to conductors of an external wiring board.