发明名称 HIGH-DENSITY ELECTRICAL INTERCONNECT SYSTEM
摘要 <p>An electrical interconnect system includes a support element; and an array of groups of multiple electrically conductive contacts arranged on the support element such that at least one contact of each group includes a front surface facing outwardly and away from that group along a line initially intersected by a side surface of a contact from another one of the groups of the array. The groups may be arranged in a configuration such that the array has a density of at least 500, 600, or 1,000 contacts per square inch.</p>
申请公布号 WO1995024748(A1) 申请公布日期 1995.09.14
申请号 US1995002679 申请日期 1995.03.09
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