发明名称 Automated electroplating apparatus for electroplating integrated circuits
摘要 <p>The apparatus comprises a plurality of adjacent processing cells, at least one of which is elongated, gripping means for gripping articles to be plated and at least one transporting means comprising a plurality of transporters for transporting the gripping means from cell to cell, the direction of movement of the gripping means from cell to cell being transverse to the longitudinal axis of the elongated processing cell. The apparatus further includes a support means to support the gripping means at each cell. The gripping means comprises a number of pivotable gripping members, which may be arranged in a row, attached to a flight bar.</p>
申请公布号 GB2287251(A) 申请公布日期 1995.09.13
申请号 GB19940004478 申请日期 1994.03.08
申请人 * PROCESS AUTOMATION INTERNATIONAL LIMITED 发明人 SHEUNG KWONG * NG
分类号 C25D17/28;(IPC1-7):B65G49/02;C25D17/16;C25D17/06 主分类号 C25D17/28
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