| 摘要 |
PURPOSE:To leave a margin in cut-remaining width to light-emitting dots at both ends, and to obtain high yield on manufacture in spite of high density by vertically displacing and arranging the light-emitting dots at both ends to the center of the row of light-emitting dots in the light-emitting dots disposed in a row in a high-density light-emitting diode array. CONSTITUTION:A light-emitting dot 8 on an end in a chip 21 on the left side is displaced and arranged slightly to a lower section from the center line 13 of the row of light-emitting dots 2 on the inside and a light-emitting dot 8 at the end of a chip 21 on the right side to an upper section from the center of the row of the light-emitting dots 2 on the inside. A dicing groove 9 in the vertical direction is inclined to the row of the light-emitting dots in response to the displacement and arrangement of the light-emitting dots 8, 8, each chip cut surface 10 is rotated at 10 deg. while using a point (a) as a center so as to be separated from the light-emitting dots 8, 8 at the ends, and horizontal distances with the chip cut surfaces 10 are made larger than cut-remaining width Y in the outermost side faces of the light-emitting dots 8, 8 at the ends of the chips. Accordingly, distances from the cut surfaces of chips be dicing to the light-emitting does 8, 8 at the ends of the chips can be separated largely. |
