发明名称 METHOD FOR SLICING INGOT
摘要 PURPOSE:To simply remove a damaged layer generated at the time of grooving by a method wherein grooves are formed on the outer peripheral surface of an ingot, and the outer peripheral surface of the ingot and the inner parts of the grooves are etched. CONSTITUTION:An ingot 1 chucked by a chucking part is rotated at a predetermined speed. A grooving part 2 is moved to the ingot 1. Grooving blades 2a are pressed against the outer peripheral surface of the ingot 1. Grooves 5 are gradually formed on the outer peripheral surface of the ingot 1 at intervals of the grooving blades 2a. Next, the outer peripheral surface of the ingot 1 is etched for the removal of a damaged layer. The grooves 5 of the ingot 1 and cutting wires are set accurately in an axial direction. After that, while the cutting wires are run in a fixed direction by actuating a wire drive part, the cutting wires gradually cut the ingot 1 along the grooves 5. In this manner, the damaged layer formed at the time of machining by the grooving blades 2a is removed by etching.
申请公布号 JPH07232319(A) 申请公布日期 1995.09.05
申请号 JP19940052915 申请日期 1994.02.24
申请人 M SETETSUKU KK 发明人 MATSUMIYA RITSUO;KONAKA TOSHINORI;ITO TAKASHI;KINAMI HARUYUKI;SAITO HIROYUKI
分类号 B24B27/06;B28D5/00;B28D5/02;H01L21/304;(IPC1-7):B28D5/00 主分类号 B24B27/06
代理机构 代理人
主权项
地址