| 摘要 |
PURPOSE:To accurately cut a multilayer printed wiring board element which is laminated by aligning a plurality of inner-layer circuits for each individual inner-layer circuit. CONSTITUTION:By measuring the distance between pitches of a position indication mark 3 at two positions which are indicated in advance in inner-layer circuits 2a and 2c positioned at both edges of a multilayer printed wiring board element 1 which is laminated by aligning a plurality of inner-layer circuits 2a, 2b,..., the amount of deviation among the inner-layer circuits 2a, 2b,... is calculated and a cutting position is determined based on it before cutting. |
