| 摘要 |
The present invention concerns a crimp contact used for connecting electrical wires. The said crimp contact is of the type consisting of a strip of electrically conductive material, for example copper, crimped to form a substantially square shape, with rounded corners and edges. According to the present invention, the electrically conductive base material is backed with a layer of soldering material, for example tin, in various shapes and size. In addition, solder flux may be advantageously placed between the soldering material and the electrically conductive base.
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