| 摘要 |
PURPOSE:To improve the moisture resistance in a semiconductor device having laminated lead parts. CONSTITUTION:In the semiconductor device 1, an upper side LOC 13 and a lower side LOC 14 are laminatedly arranged in a package 2. The lead 3 of upper side LOC 13 is integrally formed of an inner lead 10 and, an outer lead 11 but the lead 23 of lower side LOC 14 comprises inner lead only and the outer side is welded into the inner lead 10 of the lead 3 comprising the upper side LOC 13. The inner lead 10 of the upper side LOC 13 and the inner lead 20 of the lower side LOC 14 are mutually lamination-structured but partly avoiding the direct lamination so that no gap may be made at all between the inner leads 10 and 20 for suppressing the intrusion of any water content. Besides, the weld is situated in the package 2. |
