MULTICHIP MODULE WITH INTERCONNECTION DECAL MANUFACTURED BY MANDREL

摘要

PURPOSE: To provide a manufacturing method of a multi-chip integrated circuit device, which can securely and easily connect an integraged circuit chip having fine pitches and an LTCC pad with the rough pitches of a multilayer lower temperature co-burning ceramic module. CONSTITUTION: An interconnecting decal 57, having the pattern of a conductor trace 46 connected to a primary interconnecting decal pad 55 and a secondary interconnecting decal pad 50 is formed. Plural integrated circuit chips 62 supporting the plural chip pads 60 are supplied. The chip pad 60 is connected to the selected primary decal pad 55 by wire bond 68 and the like. The secondary decal pad 50 is connected to an LTCC pad 70, and the chip 62 and the decal 57 are connected to a substrate 58.