| 摘要 |
PURPOSE:To improve the overlay accuracy by using the laser in a demagnifying projection exposure device without performing alkali chemical treatment, after printing and transferring a semiconductor substrate to be used to improve the accuracy of the semiconductor pattern overlay. CONSTITUTION:Alignment in the previous process is performed by using alignment marks 1a-1a'' with laser beam application and exposure is performed. At that time, the areas to be exposed are limited to the areas with the alignment marks 1b-1b' using shielding plates. After the exposure, the deviation of the alignment marks 1b-1b' from the alignment marks 1a-1a'' of the previous process is read using the same laser beams and the deviation is corrected. When the deviation is corrected, the shielding plates are removed and the circuit parts of the product is exposed. Since the circuit parts of the semiconductor substrate used for the alignment is not exposed, reproduction is not necessitated and it can be used without any additional process. |
