| 摘要 |
PURPOSE:To provide a semiconductor device in which the measuring efficiency is enhanced by simultaneously touching a probe to a plurality of semiconductor chips to make electrical measurement. CONSTITUTION:The coordinate of the formation direction of a bonding pad 4 at one end of a semiconductor chip A1 is different from the coordinate of the bonding pad 4 formed on scribelane 2 adjacent to the formation direction of the bonding pad 4 of a semiconductor chip B3. The coordinate of the formation direction of the bonding pad formed at one side of the semiconductor A1 is apart by at least 100mum from the coordinate of the bonding pad 4 of the semiconductor chip B3 formed on the scribelane 2 adjacent to the formation direction of the bonding pad 4 formed at one side of semiconductor chip A1. |
