| 摘要 |
1,079,549. Semi-conductor devices. CKD PRAHA NARODNI PODNIK. Dec. 18, 1964 [Dec. 21, 1963], No. 51555/64. Heading H1K. The connection between a semi-conductor wafer attached to the base of a vacuum-tight casing and an electrode mounted in a bushing at the top of the casing includes two interengaging parts one of which resiliently fits within the other so that the arrangement prevents the semi-conductor wafer from being damaged when the various parts undergo thermal expansion. The bushed electrode 5 may itself form one of the parts. Inside the casing it is provided with a bore into which fits the end of a body 6 attached to the semi-conductor wafer 1. The end of the body is in the form of a cylindrical or frusto-conical piece which has been split longitudinally in two planes to provide four flexible prongs 6. In a different embodiment the bushed electrode has a wide bore within which is attached the springy portion of a wire extending from the bore. The rigid end of this wire fits within the prongs of a member attached to the semi-conductor wafer. |
