| 摘要 |
<p>Multi-layer, heat-curable adhesive film having a tacky external curable layer A and a dry external curable layer B, containing various adducts which contain epoxide groups and are formed from an aromatic diglycidyl or polyglycidyl ether together with a carboxyl-terminated butadiene/acrylonitrile rubber and adducts of this type with a car boxyl-terminated polyester, and also aromatic diglycidyl or polyglycidyl ethers, varying amounts of fillers, dicyandiamide as a curing agent, a curing accelerator and, if appropriate, a carrier material between the layers A and B, is suitable for bonding various substrates and is preferably employed for bonding metal structural components without prior cleaning of these components.</p> |
