发明名称 |
Semiconductor component and method for the manufacturing thereof |
摘要 |
A semiconductor component comprises a semiconductor body that has its underside secured on a metallic substrate and is joined at its upper side to an auxiliary member composed of a material having great thermal conductivity and which serves as a heat buffer. This auxiliary member increases the loadability of the semiconductor component with respect to additional, thermal stressing pulses.
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申请公布号 |
US5436502(A) |
申请公布日期 |
1995.07.25 |
申请号 |
US19940327220 |
申请日期 |
1994.10.21 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
KUHNERT, REINHOLD;TUERKES, PETER |
分类号 |
H01L23/58;H01L23/36;H01L23/373;(IPC1-7):H01L23/02;H01L29/74 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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