| 摘要 |
PURPOSE:To realize high density mounting, and facilitate mounting onto a board without exerting adverse influence upon a semiconductor chip, by two- dimensionally arranging I/O terminals on the whole surface of a semiconductor chip which terminals have been arranged in only the periperal part of a chip. CONSTITUTION:A first patterned wiring layer 4 is formed on a first insulating layer 3 and I/O terminals 2. Conductor posts 7 composed of Cu and Au are formed in a lattice type on the main surface of a semiconductor chip 1. As to the I/O terminals 2 and the conductor posts 7, a conductor post 7a is connected with, e.g. an I/O terminal 2a through a first wiring layer 4a, and a conductor post 7b is connected with an I/O terminal 2b through a first wiring layer 4b. Thereby, e.g. I/O terminal 2b which has no connection objects with the conductor posts 7 in the uppermost row can form the first wiring layer 4 between the conductor posts 7, so that the intervals of the conductor posts 7 can be reduced. Hence high density mounting is enabled. |
