Resin Compound for Molding Die, Molding Die and Material Molding by the Molding Die,申请号CA19942157571-传众专利搜索

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发明名称	Resin Compound for Molding Die, Molding Die and Material Molding by the Molding Die
摘要
申请公布号	CA2157571(A1)	申请公布日期	1995.07.13
申请号	CA19942157571	申请日期	1994.12.28
申请人	OTSUKA KAGAKU KABUSHIKI KAISHA	发明人	ICHIKAWA, TASUHIKO;SAKANE, KOJI;TSUJIKAWA, YOZABURO;TASAKA, TAKIO
分类号	B29C33/30;B29C33/38;B29C33/44;B29C45/17	主分类号	B29C33/30
代理机构		代理人
主权项
地址

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