High adhesion, solderable, metallization materials

摘要

A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.