发明名称 METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
摘要 <p>The average depth and concentration of oxygen by a series of oxygen ion implantation are changed continuously or stepwise for every implantation in such a way that there is one maximum in the oxygen atom concentration distribution in the depth direction, and the concentration is constant at the same depth. The maximum oxygen atom concentration is preferably 1.0 to 2.25 x 1022 cm-3. The total dosage is equal to the product of the thickness of a desired buried oxide film by a value 48 x 1022. After the ion implantation, heat treatment at above 1,300 °C is preferably done to form the buried oxide film.</p>
申请公布号 WO1995018462(P1) 申请公布日期 1995.07.06
申请号 JP1994002297 申请日期 1994.12.28
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