| 摘要 |
<p>PURPOSE:To lessen a work in amount of deviation in a lateral direction when the work is corrected in gradient. CONSTITUTION:A wafer 21 is placed on a gradient correction table 23 through the intermediary of a wafer chuck 22, a ring-shaped plate spring 25 is mounted on a gradient correction table 23 through the intermediary of mounting screws 28D to 28F, and the ring-shaped plate spring 25 is mounted on projections 24a and 24c of a base plate 24 through the intermediary of mounting screws 28A to 28C. A wafer 21 is corrected in angle of inclination and height by displacing three pivots 32A to 32C provided to the base of the gradient correction table 23 with a vertical drive means 26A provided onto the base plate 24.</p> |
