发明名称 |
METAL ELECTRONIC PACKAGE INCORPORATING A MULTI-CHIP MODULE. |
摘要 |
There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof. |
申请公布号 |
EP0656150(A1) |
申请公布日期 |
1995.06.07 |
申请号 |
EP19930918511 |
申请日期 |
1993.08.02 |
申请人 |
OLIN CORPORATION |
发明人 |
BRADEN, JEFFREY, S.;CRANE, JACOB;MAHULIKAR, DEEPAK |
分类号 |
H01L25/18;H01L23/057;H01L23/10;H01L23/14;H01L23/48;H01L23/495;H01L25/04;H01L25/065 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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