发明名称 SOLDERING TERMINAL FOR HEAT SINK
摘要 PURPOSE:To provide a soldering terminal for a heat sink having excellent workability at the time of mounting and capable of easily fixing the heat sink positively. CONSTITUTION:A heat sink 6 is held and supported by a body section 11, the heat sink is self-sustained to a printed wiring board by a pedestal section 14 installed at a right angle to the body section 11, and inserting sections 15 extended downward from the body section 11 are inserted into through-holes, thus retaining the heat sink onto the printed wiring board while the heat sink is fixed onto the printed wiring board by soldering the inserting sections. When the inserting sections are soldered to the printed wiring board, heat conduction from the inserting sections to the heat sink is prevented by slit sections 16 for obviating heat conduction set up at the roots of the inserting sections 15, thus facilitating soldering.
申请公布号 JPH07122836(A) 申请公布日期 1995.05.12
申请号 JP19930268543 申请日期 1993.10.27
申请人 FUJITSU DENSO LTD 发明人 YOSHINAGA TOSHIO
分类号 H05K7/20;H01L23/40;H05K1/18;H05K3/34;(IPC1-7):H05K1/18 主分类号 H05K7/20
代理机构 代理人
主权项
地址