| 摘要 |
A multi-chip module includes a base board (30), a thin-film multi-layer circuit board (32) which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements (32A-5) mounted on a main surface of the thin-film multi-layer circuit board, and terminals (34) which are attached to the main surface of the thin-film multilayer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted. <IMAGE> |
