发明名称 BASE PLATE PIERCING METHOD AND DEVICE AND BASE PLATE SUBJECTED TO PIERCING
摘要 PURPOSE:To obtain the base plate piercing method and device and the base plate subjected to piercing in which a micropore is machined inexpensively in a short time by suppressing the effect on photodiodes to the minimum on the center of the concentric circular arcuate photodiodes of the base plate. CONSTITUTION:In the piercing method where plural diodes formed on the base plate surface side are arranged in a concentric circular arcuate shape and the micropore is formed on the center of the circular arcuate photodiodes of the base plate 1 which detects diffracted light received on the surface side, a flame retarding film 30 covers the surface of the base plate 1. The rear of the base plate 1 is opposed to a laser beam, the center of the circular arcuate photodiodes is matched with an optical axis of laser beam to position the base plate 1, the base plate 1 is irradiated with the YAG laser beam of 0.01-0.15J per pulse with 10-100Hz pulse frequency and a hole having 24-100mum diameter is formed on the center of the circular arcuate photodiodes.
申请公布号 JPH07108392(A) 申请公布日期 1995.04.25
申请号 JP19930278900 申请日期 1993.10.13
申请人 SEISHIN KIGYO:KK 发明人 IWAMOTO KUNIO;OSUMI MICHIO
分类号 B23K26/00;B23K26/38;H01L21/268;H01L31/02;H01L31/10 主分类号 B23K26/00
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