Thin-film wiring layout for a non-planar thin-film structure.

摘要

A thin-film arrangement for a non-planar structure is described. The structure includes a substrate (14) and a plurality of thin-film layers stacked on top of each other above the substrate. The layers contain conductive patterns (27-30) and vias (19-26) that provide connections between the conductive pattern in one of the layers to the conductive pattern in another layer. Vias that provide a connection between the conductive pattern of one layer are offset and in contact with respect to each other and are positioned in a non-linear arrangement, preferably in the form of a helix or a multiple helix.