| 摘要 |
<p>PURPOSE:To manufacture a semiconductor device having a plurality of circuits from one type of master wafer by a method wherein one chip region of the master wafer of a required die size is used as one circuit block and a plurality of the circuit blocks are connected to each other with wirings formed in scribe regions to compose one total circuit. CONSTITUTION:A semiconductor chip is composed of semiconductor chips 24 in four chip regions 16. Each semiconductor chip 24 has an inner core part 20 having required functions and circuits and an I/O part 22. In the I/O parts 22 of the 4 semiconductor chips 24, I/O parts 22a for mutual connection between the semiconductor chips 24 are connected to each other with metal wirings 26 in scribe regions 18 to compose one semiconductor chip having required functions and circuit scale of the four semiconductor chips 24. Bonding pads 23 in I/O parts 22b which are not used for the mutual connection between the semiconductor chips 24 are connected to the leads of a lead frame with bonding wires. Finally, resin sealing is applied to complete one semiconductor chip.</p> |
