MODULE OF SEALED SEMICONDUCTOR CHIP, AND MODULE FORMING METHOD

摘要

PURPOSE: To provide a method for forming an improved-type read-on-chip semiconductor module where wire bond cannot be damaged due to a temperature fluctuation cycle and the improved-type module of this type. CONSTITUTION: In a read-on-chip semiconductor device, a semiconductor chip 12 with a main surface having input and output bonding pads 18 is fixed on a lead frame and a lead wire 14 is connected to a chip pad by a bonding wire 20. A coating of dielectric material with Young's modulus of within a range of approximately 0.7-35 kg/cm<2> (approximately 10-500 psi) is provided around the total length of each wire, on the pad, and on a part where the wire of each lead wire is connected, thus functioning as a stress buffer material 28. The material preferably should have at least -40 deg.C Tg.