| 摘要 |
Bare IC chips (201 through 203) are mounted on regions (101 through 103) of a printed wiring board (100), respectively. The chips are soldered to a motherboard at external electrode pads (105) on their borders. Lead pads (107) and the external electrode pads (105) are interconnected through a circuit pattern (109), through-holes (111) and interstitial via- holes (112). A circuit pattern (109) is disposed on a die bonding surface of the bare IC chips (201,202) for which insulation is not necessary. A multi-chip module is thus completed.
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