| 摘要 |
PURPOSE:To realize miniaturization and thinning by accommodating a semiconductor chip and a multilayered transformer in a common resin molding package to integrate them in a body. CONSTITUTION:A multilayered transformer 24 and a semiconductor chip 25 involving a power supply circuit element are mounted on a circuit board 21 wherein a specified wiring pattern 23 is formed and outer leads 22 are connected with the end portion of the board. A resin mold 27 surrounds the whole part except a part of the outer leads 22. The multilayered transformer 24 is constituted by laminating a short coil 43 which is electrically connected with the wiring patterns 23 on both surfaces of the circuit board 21 via a through hole 44, an insulating layer 42 and a soft magnetic film 41. Thereby sufficient miniaturization and thinning can be realized, and heat dissipating property can be increased by arranging a heat spreader on the surface of the multilayered transformer. |
