发明名称 |
DEVICE FOR COATING SUBSTRATES IN SEMICONDUCTOR MANUFACTURE |
摘要 |
The invention concerns a device for coating substrates (20). The coating material is first applied to the substrate (20) by means of a capillary slit (21), and in a subsequent centrifuging operation the film is made uniform and reduced in thickness. |
申请公布号 |
WO9505901(A1) |
申请公布日期 |
1995.03.02 |
申请号 |
WO1993DE00778 |
申请日期 |
1993.08.26 |
申请人 |
STEAG MICRO-TECH GMBH STERNENFELS |
发明人 |
MUEHLFRIEDEL, EBERHARD;KALLIS, MARTIN;APPICH, KARL |
分类号 |
B05D1/40;B05C9/02;B05C9/12;B05C11/08;B05C11/105;B05C13/00;B05D1/00;B05D1/26;B05D7/26;H01L21/00 |
主分类号 |
B05D1/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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