| 摘要 |
<p>A polymer lead frame is made from a flexible substrate (24) with flexible conductive traces (26). The generally square lead frame has diagonal cut-outs (42-48) partially extending from the corners towards the centre, as well as a central hole (62) that lies within a footprint of a die. The die (22) is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive (32). The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterised by a non-planar, non-bumplike surface with concavities having depths of at least one-seventh the diameter of conductive particles in the anisotropic conductive adhesive. <IMAGE></p> |
