发明名称 Method of processing a polycide structure
摘要 A method substantially eliminating consumption of silicon from semiconductor devices is provided. The method includes controlling gases within the environment wherein the semiconductor device is positioned. The environment is formed to include an inert gas and oxygen. The oxygen content is formed to have a concentration between approximately 1x101 and 1x105 parts per million. Such an oxygen concentration substantially prevents converting silicon from the semiconductor device into silicon monoxide thereby substantially eliminating silicon consumption.
申请公布号 US5389576(A) 申请公布日期 1995.02.14
申请号 US19920997425 申请日期 1992.12.28
申请人 MOTOROLA, INC. 发明人 LESK, ISRAEL A.
分类号 H01L21/28;H01L21/285;H01L21/3205;H01L21/336;H01L23/52;H01L29/49;H01L29/78;(IPC1-7):H01L21/44;H01L21/48 主分类号 H01L21/28
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