| 摘要 |
PURPOSE:To realize a thin device, make it unnecessary to add releaser, improve adhesion between sealing resin and a semiconductor element, etc., and obtain high resistance to moisture, by resin-molding a semiconductor chip, TAB leads on an organic system insulative substrate, etc., by using a screen printing method. CONSTITUTION:The title device is provided with a semiconductor chip 1, an organic system insulative substrate 5 for mounting the semiconductor chip 1, and outer electrodes formed of a Pb-plated single-layered TAB tape 4 which is connected with the semiconductor chip 1 via Au wires 2. The TAB tape 4 is formed on the semiconductor chip mounting surface of the organic system insulative 5, except the part where the semiconductor chip is to be mounted. Further the device is provided with the following; an insulating paste layer 6 which is spread on the organic system insulative substrate 5 by screen printing, and used for bonding the semiconductor chip 1 and the leads to the substrate 5, and a resin molding member 3 for rein-molding at least the semiconductor chip 1, the leads, and the Au wires 2 by screen printing. |
