首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
DEVICE FOR TEMPERATURE COMPENSATION
摘要
申请公布号
RU1627062(C)
申请公布日期
1995.01.27
申请号
SU19894724026
申请日期
1989.07.27
申请人
NAUCHNO-PROIZVODSTVENNOE OB"EDINENIE AVTOMATIKI
发明人
BAJKOV YU.G.
分类号
H03K17/14;(IPC1-7):H03K17/14
主分类号
H03K17/14
代理机构
代理人
主权项
地址
您可能感兴趣的专利
BOARD BOOK CAPABLE OF MOUNTING A SMARTPHONE
APPARATUS FOR CONNECTING GUARD FENCE ON THE BRIDGE
METHOD AND APPARATUS OF SELECTING COOPERATION TERMINAL BASED ON MOBILITY OF TERMINALS
TUNNELING FIELD EFFECT TRANSISTOR WITH ASYMMETRICAL ACTIVE REGION
LIGHT EMITTING DIODE CIRCUIT HAVING CONTROL CIRCUIT CONNECTED IN PARALLEL WITH LIGHT EMITTING DIODES
coffee-mix including coffee-stick
RETRIEVAL METHOD OF MISSING PORTABLE DEVICE INCLUDING DUAL SIM CARD AND PORTABLE DEVICE THEREOF
POWER SOURCE DEVICE FOR DETECTOR, LIGHT OR RADIATION DETECTING SYSTEM HAVING THE DEVICE
Machine to Produce Expanded Metal Spirally Lock-seamed Tubing from Solid Coil Stock
System and method for multi-media broad casting using priority information on BIFS packet header in DMB mobile terminal
TAPERED ASYMMETRIC BLOCK COPOLYMERS AND ADHESIVES COMPOSITION COMPRISING THE SAME
Producing carbon monoxide combined with production of hydrogen from hydrocarbon mixture, by reforming hydrocarbon mixture to obtain synthesis gas, cooling synthesis gas with heat recovery, and extracting carbon dioxide in cooled syngas
POUDRE DE LAIT FERMENTE OU YAOURT A HAUTE DENSITE EN FERMENTS LACTIQUES
PISTON PRIMAIRE DE MAITRE-CYLINDRE TANDEM ET MAITRE-CYLINDRE TANDEM EQUIPE D'UN TEL PISTON PRIMAIRE
BOUCHON POUR FERMER UN RECIPIENT
Compact machine for manufacturing resilient casing in form of e.g. envelope in industrial production, has intermediary deflecting unit for film and fastened at base plate to supply deflecting unit above from coil of tension unit
BOITIER, EN PARTICULIER POUR BIOPILE
DISPOSITIF D'ASSISTANCE AU FREINAGE ET VEHICULE AUTOMOBILE COMPORTANT UN TEL DISPOSITIF
COMPOSITION COSMETIQUE COMPRENANT UN COMPOSE D'ACIDE CUCURBIQUE ET UNE INULINE HYDROPHOBE
FRAME OF SEMICONDUCTOR MEASURING APPARATUS AND TEST MODULE USED IN THE APPARATUS
