| 摘要 |
PURPOSE:To mount an IC package on a mounting board, an IC socket or the like without dislocation by a method wherein a positioning protrusion which is formed in the central part on the surface of the IC package is fitted to a positioning hollow which has been formed in the central part on the suction face of a suction jig and the IC package is positioned to the suction jig. CONSTITUTION:In an IC package 10, a quadrangular pyramid-shaped protrusion 11 is formed in the central part on the package surface of a plastic package 13 in which an IC chip has been sealed at the inside. In addition, in a suction jig for an IC package transfer machine, a quadrangular pyramid-shaped hollow is formed in the central part on the suction face of the body of the suction jig made of a hardened plastic or a metal. Then, quadrangular pyramids for the positioning protrusion 11 and the positioning hollow are formed in such a way that their shape and their size are nearly identical. The IC package 10 which is placed in a tray is sucked when it is evacuated from a vacuum suction hole in the suction jig for the transfer machine, and it is transferred. At this time, uneven parts for the protrusion 11 and the hollow are fitted precisely. |
