发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING THEREOF
摘要 PURPOSE:To provide a semiconductor device and a manufacturing method, in which a contact state between a capacitor dielectric film made of high permittivity material and a layer insulating film under the capacitor dielectric film can be improved, and leak current from a lower capacitor electrode is prevented effectively. CONSTITUTION:In a semiconductor device, a contact layer 11 made of TiO2, ZrO2, Ta2O5, Si3N4 or Al2O3 is formed between a silicon-oxide layer insulating film 10 and a high-permittivity film 15.
申请公布号 JPH0714993(A) 申请公布日期 1995.01.17
申请号 JP19930147992 申请日期 1993.06.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 OKUDAIRA TOMOHITO;KUROIWA TAKEHARU
分类号 H01L27/04;H01L21/02;H01L21/822;H01L27/108 主分类号 H01L27/04
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