| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component device having a lid which is not peeled off from a substrate, when thermal stress such as solder reflow is applied, and both the electronic component device and a mother board can be mounted stably, after the electronic component device has been mounted on the mother board. SOLUTION: In this electronic component device, a substrate 1 has a part 4 where one surface is opened and the section is recessed, an electronic component element 3 is accommodated in the recessed part 4, and the aperture of the recessed part 4 is sealed with a lid member 7 for sealing, which is constituted of the laminated structure of a metal layer 7a on the exposed surface side and a resin layer 7b of a substrate jointing surface side.</p> |
