| 发明名称 |
Method for bonding substrates with silicone rubber. |
| 摘要 |
<p>A method for bonding substrates with silicone rubber substantially shortens the setting time and provides good bonding of the substrates by using a silicone rubber composition comprised of a thermal-crosslinking component and moisture-crosslinking component.</p> |
| 申请公布号 |
EP0630952(A1) |
申请公布日期 |
1994.12.28 |
| 申请号 |
EP19940107650 |
申请日期 |
1994.05.17 |
| 申请人 |
DOW CORNING TORAY SILICONE COMPANY, LIMITED |
发明人 |
ONISHI, MASAYUKI, TORAY DOW CORNING |
| 分类号 |
C09J5/00;C09J5/06;C09J183/00;C09J183/04;H05K3/30;(IPC1-7):C09J5/06 |
主分类号 |
C09J5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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