A tape for encasing electronic parts.

摘要

The present invention relates to a tape for encasing electronic parts. In conventional packages for encasing electronic parts, a film made of polyester resin is used as a cover tape. Peeling of the polyester cover tape from a carrier tape cannot be effected smoothly because the peeling adhesivity between the cover tape and the carrier tape is not uniform. This invention provides a tape for encasing electronic parts comprising a carrier tape having a plurality of recesses for encasing electronic parts and a plurality of guide perforations, and a cover tape pasted onto said carrier tape with an adhesive so as to seal only said recesses while leaving said guide perforations open. The cover tape is a nylon based resin sheet, and the adhesive is an ethylene-vinyl acetate copolymer-based adhesive. The cover tape can be pulled smoothly from the carrier tape during automatic assembly of circuit boards.