发明名称 |
PRODUCTION OF MULTILAYER PRINTED WIRING BOARD |
摘要 |
PURPOSE:To provide a method for producing a rigid flexible multilayer printed wiring board having highly reliable rigid part and flexible part. CONSTITUTION:A printed wiring board having at least one flexible layer is combined with a printed wiring board having at least one rigid layer to produce a multilayer printed wiring board wherein no adhesive is used on the circuit at the time of formation of a protective film layer in order to protect the flexible layer. |
申请公布号 |
JPH06350255(A) |
申请公布日期 |
1994.12.22 |
申请号 |
JP19930135816 |
申请日期 |
1993.06.07 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
YOSHIMURA NAOHITO;HIRUKAWA KOJI;NOZAKI MITSURU;NAKANO KOICHI |
分类号 |
H05K1/03;H05K3/00;H05K3/28;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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