发明名称 PRODUCTION OF MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To provide a method for producing a rigid flexible multilayer printed wiring board having highly reliable rigid part and flexible part. CONSTITUTION:A printed wiring board having at least one flexible layer is combined with a printed wiring board having at least one rigid layer to produce a multilayer printed wiring board wherein no adhesive is used on the circuit at the time of formation of a protective film layer in order to protect the flexible layer.
申请公布号 JPH06350255(A) 申请公布日期 1994.12.22
申请号 JP19930135816 申请日期 1993.06.07
申请人 MITSUBISHI GAS CHEM CO INC 发明人 YOSHIMURA NAOHITO;HIRUKAWA KOJI;NOZAKI MITSURU;NAKANO KOICHI
分类号 H05K1/03;H05K3/00;H05K3/28;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/03
代理机构 代理人
主权项
地址