发明名称 LEAD FRAME CLAMPING MECHANISM FOR WIRE BONDER
摘要 PURPOSE:To provide a lead frame clamping mechanism for a wire bonder which can uniformly press a lead frame clamping member against a lead frame, without necessitating the inclination adjustment of a clamper main body. CONSTITUTION:This mechanism is provided with the following; a clamper main body 1 having an aperture part 4 with a specified shape, a lead frame clamping member 2 constituted of a cylindrical part 7 wherein a lead frame abutting part 6 of the top part protrudes on the lower surface side of the clamper main body 1 via the aperture part 4, and a flange part 8 which is fromed so as to stretch outward from the rear end of the cylindrical part 7 and engaged with the upper surface side of the clamper main body 1, and an elastic member 3 which elastically retains the lead frame clamping member 2 so as to be vertically movable with respect to the clamper main body 1.
申请公布号 JPH06349884(A) 申请公布日期 1994.12.22
申请号 JP19930166414 申请日期 1993.06.11
申请人 SONY CORP 发明人 TSUNEMI DAIKI;TANAKA SHINICHI
分类号 H01L21/60;H01L21/68;H01L23/50 主分类号 H01L21/60
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