| 摘要 |
PURPOSE:To provide a separating device for the semiconductor laser parts which can separate a plurality of semiconductor laser parts cut out from a wafer, one by one, without damaging the semiconductor laser parts. CONSTITUTION:A separating device for semiconductor laser parts is equipped with a part placing table 3 on which a plurality of semiconductor laser parts 2 are arranged in a closely attached state, part driving-out mechanism 4 for shifting the part placing table 3 in the arrangement direction X of the semiconductor laser part 2, and a rotary wheel 5 which has suction holes 7 for sucking the semiconductor laser parts 2 driven out by the part driving-out mechanism 4 one by one, on the outer peripheral surface. |
