| 摘要 |
IPM transfer molding is provided to adjust the interval between a die paddle and a damper in a die of the IPM so that a lead frame is prevented from being stuck or pressed. A lead frame(7), a lead frame body(1), and an IPM body(10) are formed. The lead frame provides an electrical conduction passage to an IPM substrate. The lead frame body supports the edge of the lead frame. The IPM body shields the IPM substrate soldered at the center of the lead frame. A shielding resin is supplied through a shielding resin supplying die. The shielding resin is prevented from leaking by a line of a damper(5). The shielding resin supplying die approaches the line of the damper to supply the shielding resin and then cure the shielding resin, thereby forming the IPM body.
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