| 摘要 |
<p>PURPOSE:To provide a semiconductor manufacturing device which prevents carriage troubles and does not give damages to a thin insulating film formed in a subject to be processed. CONSTITUTION:A semiconductor manufacturing device is provided with a chamber 20 for exciting reacting gas by high-frequency power and performing prescribed process on a wafer 10, a susceptor 12 for placing the wafer 10, a lift pin 16 for releasing the wafer 10 from the susceptor 12 and a resistance 26 for gradually discharging charges accumulated on the wafer 10 during the process. Such constitution does not allow the wafer 10 and the susceptor 12 to be attracted by an electrostatic chuck and carriage troubles are prevented. Even when the wafer 10 is placed far from the susceptor 12 or when a handler is permitted to make contact with the wafer 10, potential change in the wafer 10 is extremely small or zero and damages on the gate insulating film is prevented.</p> |
