| 摘要 |
<p>PURPOSE:To effect good coining positively by setting the punching face for coining smaller than the wire bonding pad face of a lead frame and subjecting the wire bonding part of the bonding pad face to coining. CONSTITUTION:Coining is effected by punching the bonding pad region of a lead frame 1 placed on a fixed base which is disposed oppositely to a punch, having a punching face smaller than the bonding pad face 1a and containable within the bonding pad region, and movably up and down. Consequently, a coining face 4a is provided at a part of the punched lead frame 1 including the wire bonding face 3a of the bonding pad face 1a except the peripheral part of the bonding pad face. This method prevents the burr 5 on the periphery of the bonding pad face 1a from interfering with the punching face.</p> |
