| 摘要 |
PURPOSE:To provide a conductive paste to be used for a multilayered ceramic circuit board and provide a multilayered circuit board using the paste wherein the paste can be baked mainly at temperature as low as 950 deg.C or lower. CONSTITUTION:A conductive paste consists of 93-97 parts by weight of Ag, 0.5-2 parts by weight of Pd, and balance Au and/or Pt (wherein Au in 0-5 parts by weight and Pt in 0-3 parts by weight). Further the conductive paste contains 0.3-3 parts by weight (to 100 parts by weight) of crystallized glass and a proper amount of organic vehicle. Regarding a multilayered ceramic circuit board in which an inner circuit of Ag and a surface conductor 4 of Ag-Pd are connected, the conductive paste is used for via 2 to connect the inner circuit 3 of Ag and the surface conductor 4 of Ag-Pd. Consequently, the inner circuit 3 of Ag and the surface conductor 4 of Ag-Pd are connected well, so that a multilayered ceramic board with excellent connection reliability and for which Ag conductor with low resistance is used as the inner circuit is provided. Since crystallized glass is compound to the conductive paste, adhesion to the setter does not occur and cracks are not formed either, owing to a conductive paste relating to the present invention. |
