| 摘要 |
<p>PURPOSE:To clean the peripheral part of both surfaces of a semiconductor wafer by retaining the semiconductor wafer at opposing first edge parts for performing first brush scrubbing and then retaining the semiconductor wafer at opposing second edge parts which do not overlap the first edge parts for performing second brush scrubbing two times or more. CONSTITUTION:A wafer 3 is retained so that it is sandwiched by the opposing edge parts of the wafer by wafer retention tools 2a and 2b and is moved while a brush 1 is rotated, thus scrubbing both surfaces of the wafer 3. Then, the wafer 3 is retained by bringing closer the wafer retention tools 2c and 2d for retaining the wafer horizontally at different edge parts which do not overlap the edge parts where the wafer retention tools 2a and 2b retain the wafer the wafer retention tools 2a and 2b are separated each other. they are separated from the wafer 3, the brush 1 is moved while it is being rotated, and then a second scrubbing is performed. Scrubbing may be repeated for several times.</p> |
