| 摘要 |
PURPOSE:To prevent the occurrence of cracks in sealing resin and the occurrence of the corrosion of aluminum wirings, electrodes and the like by providing a drying steps for drying a polyimide film before a resin sealing step. CONSTITUTION:A polyimide film 6 is formed at the approximately final step of a wafer step for resin sealing of a semiconductor element 1, wherein a polyimide film 6 is formed especially on the surface. When the wafer step is finished, drying is performed especially immediately before the resin sealing after chip holding and wire bonding are finished. The drying step is performed for five minutes or longer at the temperature of 110 deg.C or less. The polyimide film 6 is dried before the resin sealing step in this way. Therefore, the occurrence of cracks and the like in the sealing resin 11 caused by the water content in the polyimide film 6 after the finish of the resin sealing can be prevented.
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